| 摘要 |
<p>PURPOSE:To provide a method of producing scribed semiconductor substrates being improved in working reliability by scribing the surface partly coated for protection purposes with a readily dissoluble substance like wax and dissolving and removing the coating following the scribing, to thereby leaving the clean and dirt-free surface. CONSTITUTION:In scribing piezo-electric substrates for elastic-surface waves or the like semiconductor substances, all areas on the surface of the substrate excluding those to be scribed are coated with a readily dissoluble substance 3, such as wax, followed by drying. The dried substance 3, after the scribing has been carried out, is dissolved away by trichloroethylene or the like solvent. According to this method, the surface of the substrate may be protected from possible injury during the scribing work; any dust on the coating surface as well as fragments of the substrate material formed by the scribing may be removed together with the dissolved coating substance, leaving the substrate surface free of foreign stains and dirt, so that subsequent wire bonding is performed with improved accuracy. This method applies in scribing most substrates including those for integrated circuit devices.</p> |
