| 摘要 |
PURPOSE:To increase both the productivity and the production yield by giving a test via the light reflection effect on the surface of the semiconductor parts and thus securing an easy and nondestructive decision to the quality of the brazing condiction of the semiconductor parts which are mass-produced in a small size. CONSTITUTION:The light of LED12 is irradiated on the mount substrate in which heat buffer plate 3 is brazed onto substrate 1 via silver frazing material 2, and the reflected light is led to photo transistor 13. Thus transistor 13 delivers the signals according to the levels of the reflected light. This light reception signal receives the waveform shaping at waveform shaping circuit 18 via amplifier 17 and is then supplied to counter 19, where the peak wave number is counted during a scanning of the light on the mount substrate. In this case, the scanning is carried out on the light mount substrate as shown by A and B by crossing on the mount substrate. In the case of the peak wave number 3 of a scanning, the brazing is decided nondefective, and otherwise the brazing is judged defective. Thus the quality of the brazing can be decided in a quick and easy way. |
