发明名称 RESIN SEALING TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To increase the holding strength of external leads, and to improve the characteristics in high-frequency, by bending the external leads so that the length of internal leads becomes short, and by coating the external leads with resin including bending working portions. CONSTITUTION:An external lead 2 for a base terminal is provided with a bending point 9 on its way. An external lead 3 for a collector terminal is continuously molded with a radiator fin 8, and a semiconductor element 5 is joined. An external lead 4 for an emitter is also equipped with a bending point 10 on its way. The element 5 and the leads 2, 4 are each connected 6, 7. The length of connection 6, 7 is shortened by installing the bending points 9, 10, the components of inductance decrease and the characteristics of high-frequency are improved. The mechanical support strength of the external leads 2, 4 augments because the bending points 9, 10 are sealed in resin.
申请公布号 JPS5550648(A) 申请公布日期 1980.04.12
申请号 JP19780123812 申请日期 1978.10.06
申请人 MITSUBISHI ELECTRIC CORP 发明人 MIZUGUCHI KIYOSHI
分类号 H01L23/48;H01L23/495 主分类号 H01L23/48
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