| 摘要 |
PURPOSE:To provide an optimum loop height for wire, by providing a friction device for pressing a wire between a wire spool and a capillary so that the pressure exerted by the friction device increases when the capillary moves downward and the pressure decreases when the capillary moves upward. CONSTITUTION:No.1 friction element 9 is provided in contact with cylindrical body 8 between wire spool 5 and capillary 14, which constitute a wire bonder. Wire 1 is pulled out downward through this. Below this is provided No.2 friction element 11, and wire 1, which passes through here, is pressed by component 10' whose end part forms a curved surface. Friction element 11 is moved up and down by means of up-and-down-moving bar 18. When capillary 14 moves downward, friction element 11 supported by weak spring 19 is pushed up by guide 17 fitted to bar 18, so that the pressure against element 10' increases. When capillary 14 moves upward, friction element 11 is restored to its former position, so that the pressure decreases. By this, the loop height is maintained at a constant level. |
