摘要 |
<p>DOUBLE EXTRUDED MOUNT A process for the formation of a mount for a semiconductor, such as a rectifier or the like, in which a steel ring and a steel tube are brazed in position on the upper surface of a previously formed hexagonal copper billet, following which the parts are coldformed in a plurality of extrusion steps for producing an accurately formed mount in which the copper material is work-hardened.</p> |