发明名称 DOUBLE EXTRUDED MOUNT
摘要 <p>DOUBLE EXTRUDED MOUNT A process for the formation of a mount for a semiconductor, such as a rectifier or the like, in which a steel ring and a steel tube are brazed in position on the upper surface of a previously formed hexagonal copper billet, following which the parts are coldformed in a plurality of extrusion steps for producing an accurately formed mount in which the copper material is work-hardened.</p>
申请公布号 CA1075376(A) 申请公布日期 1980.04.08
申请号 CA19770280657 申请日期 1977.06.16
申请人 NIPPERT COMPANY (THE) 发明人 NIPPERT, RUSSELL A.
分类号 H01L23/12;B23K1/18;H01L21/48;H01L23/14;(IPC1-7):05K5/04 主分类号 H01L23/12
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