METHOD FOR MOUNTING CHIP TYPE CIRCUIT ELEMENTS ON A PRINTED CIRCUIT BOARD AND APPARATUS FOR PERFORMING THE SAME

摘要

METHOD FOR MOUNTING CHIP TYPE CIRCUIT ELEMENTS ON A PRINTED CIRCUIT BOARD AND APPARATUS FOR PERFORMING THE SAME Chip type circuit elements are mounted on adhesive layers provided on predetermined positions of a printed circuit board pushing up each circuit element stack inserted in a magazine which is vertically held just below the corresponding adhesive layer and which is inserted through a corresponding through hole defined by a lattice-shaped and horizontally placed magazine guide. This method and apparatus can quickly mount chip type circuit elements on the printed circuit board, and make possible an easy change of the circuit element pattern, without necessitating the use of an NC machine.