发明名称 PROCESS FOR MANUFACTURING A FILLED CASING FOR A DISC SHAPE SEMICONDUCTOR BODY AND PRESENTING AT LEAST ONE PN JONCTION
摘要 <p>The filled casing is comprised of a cylindrical insulating envelope (9) and of two contact bodies (4). These bodies are provided with a flexible tubular lining (12) acting as a filling ring, previously expended by means of electron radiation, and, after introduction of these contact bodies into the envelope (9), they are heated, which further increases the thickness of the linings (12) which thereby fill the annular spacing between the contact bodies (4) and the insulating envelope (9) achieving the tightness of the casing.</p>
申请公布号 WO8000640(A1) 申请公布日期 1980.04.03
申请号 WO1979CH00070 申请日期 1979.05.18
申请人 BBC BROWN BOVERI & CIE;EISELE D 发明人 EISELE D
分类号 H01L23/04;H01L21/50;H01L23/051;H01L23/10;H01L23/48;(IPC1-7):01L21/50;01L21/60;01L23/04;01L23/10 主分类号 H01L23/04
代理机构 代理人
主权项
地址