| 摘要 |
<p>PURPOSE:To obtain a package for a semiconductor device wherein a coupling capacitor is unnecessitated, by constituting at least a part of metallized wiring, of an inner metallized layer and an outer metallized layer, the former being connected with a semiconductor chip, and the latter being connected with an external lead and arranged so as to face the former with a space. CONSTITUTION:At least a part of metallized wiring is constituted of an upper inner metallized layer 5 and an lower outer metallized Iayer 6, which form a capacitor. The former is exposed on the surface of the peripheral part 1b of a base 1. The latter is buried in the base 1 with an adequate space from the former, and the outer end of the latter is connected with an external Iead 4. A semiconductor chip C mounted on a mounting land 2 is connected with the inner exposed portion of the metallized wiring 3, by a bonding wire. There fore the capacitor constituted of the inner metallized layer 5 and the outer metallized layer 6 is fixed with a part of the metallized wiring 3 so as to be integrated in a body, so that a capacitor as a separate individual component is unnecessitated.</p> |
