| 摘要 |
<p>A semiconductor device comprises a ceramic case (2) of which the upper and lower parts are each sealed by a press-mounted electric and thermal conductor disc (1, 14). The device comprises two semiconductor discs (6, 10) mounted in series, each semiconductor disc having at least one pn junction. These discs are press-mounted with interlayers of molybdenum blanks (4, 8, 12) and silver ductile sheets (5, 7, 9 11) between the conductor discs (1, 14). A current lead (16) is fixed to that of the molybdenum blanks (8) which is between the semi-conductor discs (6, 10). This lead penetrates the case (2) by means of an insulating traverse (17) in order to distribute this voltage at each semi-conductor disc by outer connection. </p> |
