| 摘要 |
1,143,308. Semi-conductor devices. INTERNATIONAL RECTIFIER CORP. 20 March, 1967 [14 April. 1966], No. 12983/67. Heading H1K. A semi-conductor wafer-which may constitute a junction diode and be mounted between molybdenum plates-is secured to a housing base 13 and surrounded by a hollow cylindrical wall 30 bonded to the base. The lead 19 to the upper surface of the wafer is a flat strip conductor having at least one reentrant bend. As shown, there are two such bends 20 and 21, but in Fig. 5 (not shown) there is only one. A resilient solid filler 32 covers both the wafer and the bend or bends in the lead, so that the contact is of the flexible-link type. Above the resilient filler there may be a rigid filler 33, so that the projecting terminal portion 26 of the lead 19 is effectively rigid with the housing. |
