| 摘要 |
A high density solder tail connector assembly for leadless integrated circuit packages. The plastic connector package includes upper and lower header portions each having a plurality of mating terminal reception channels formed therein. The upper header portion includes probing holes to allow ready testing of integrated circuit packages mounted on the connector assembly. Each channel is designed to receive an inner and an outer type of S-shaped spring-beam contact. Each type of unitary contact includes a contacting portion, a generally S-shaped spring-beam portion, a probe portion, a base portion, and a solder tail or wire-wrap portion. The two types of contacts differ with respect to the location of the solder-tail portion. Each contact is provided with an offset or dog-leg portion adjacent to the solder tail portion which allows the two types of solder tail portions to project in a staggered fashion from the underside of the lower header, thus easing spacing requirements for printed circuit board holes into which the solder tail would be placed. Preloading means formed in the upper header portions insure that all contacts are automatically preloaded when the upper and lower header portions are secured together. |
