| 摘要 |
<p>Circuit boards are produced using a perforated polyethylene sheet by filling the perforations in the sheet with grease, placing a frame on the sheet to form a mold, mounting electrical components on the sheet by inserting the leads of the components into the perforation, applying a layer of sand to the mold surrounding the component leads but not completely covering the components, and pouring an epoxy resin into the mold, the resin mixing with the sand and filling the mold, whereby the resulting circuit board includes a solid epoxy and and body with connectors and component leads on one surface and electrical components projecting outwardly from the other surface thereof.</p> |
