| 摘要 |
PURPOSE:To prevent the deterioration in insulation resistance due to any electrolytic corrosion and the electrolytic corrosion between through holes from occurring by a method wherein a material subjected to less shifting of component by electric field is interposed between copper as wiring conductors and an insulating substrate. CONSTITUTION:A bonding agent layer containing a non-electrolytic plating catalyst is formed on the surface of an insulating substrate containing the non-electrolytic plating catalyst and then through holes are made to form resist for non-electrolytic plating in the through holes and on the parts other than the parts to be circuit parts. Next, the surface of the parts not formed of the resist is selectively roughened by immersing it in a chemical roughening solution and then immersed in a non-electrolytic nickel plating solution to be nickel-plated. The nickel plated layer shall be 0.5-10mum in thickness. Then, the nickel plated layer is immersed in a non-electrolytic copper plating solution to be copper-plated. Through these procedures, the part between wiring conductors on the surface of the insulating substrate can be prevented from deteriorating in insulation due to any electrolytic corrosion by interposing nickel as a material subjected to less shifting of component by electric field between wiring conductors and the insulating substrate. |
