SUPPORT DE DISPOSITIF OPTOELECTRONIQUE A SEMI-CONDUCTEURS ET MODULE REALISE A L'AIDE DE CE SUPPORT

摘要

A new package for semiconductor optoelectronic devices is disclosed, which comprises a novel geometrical configuration and provides plug-in capability. The package configuration provides a convenient means for supplying electrical signals to or from the device(s) within the package while maintaining a coaxial geometry, useful in optical and thermal control. Techniques for bonding devices into the package are easily automated using conventional bonding and assembly equipment. The package permits use of the device in a variety of orientations.