发明名称 PROCESS FOR PRODUCING LARGE-SIZE SUBSTRATE-BASED SEMICONDUCTOR MATERIAL
摘要 A process for producing large-size, substratebased semiconductor material of silicon deposited on a substrate body from the gaseous phase, which comprises the steps of heating a substrate body by direct current passage to deposition temperature, contacting said body with a gaseous silicon-containing mixture to which a dopant has been added, until a deposit having a thickness from about 10 to 200 .mu.m has been formed, subsequently melting 80 to 100% of the deposited silicon layer from the free surface downward, and resolidifying the molten silicon by adjustment of a temperature gradient from the substrate body upward. Large-sized plates obtained by cutting up the semiconductor material are used as solar cells.
申请公布号 CA1074428(A) 申请公布日期 1980.03.25
申请号 CA19760265373 申请日期 1976.11.10
申请人 WACKER-CHEMITRONIC GESELLESCHAFT FUER ELEKTRONIK-GRUNDSTOFFE M.B. 发明人 AUTHIER, BERNHARD;GRIESSHAMMER, RUDOLF;KOEPPL, FRANZ;LANG, WINFRIED;SIRTL, ERHARD;RATH, HEINZ-JOERG
分类号 H01L31/04;C30B13/00;C30B13/06;H01L21/205;H01L31/18 主分类号 H01L31/04
代理机构 代理人
主权项
地址