Semiconductor bridge rectifier - using two substrates, each contg. three rectifier elements, where the two direct current output leads are located on different substrates

摘要

Conductors are made from strip and located on each side of semiconductor substrates, the assembly being encapsulated in a sheath. Each of the two d.c. output connector strips is mounted on a separate semiconductor substrate; each substrate contains at least on pn junction provided with grooves to form the required number of rectifier elements, esp. three elements in each substrate for rectification of 3-phases alternating current. Different contact metals, esp. nickel, silver, copper or gold, are pref. used on contact layers on the substrate for easy visual identification of the conductivity type of the substrates. The object is the rational mass prodn. of rectifiers.