| 摘要 |
There is disclosed a thermosetting phenolic resin composition, suitable for use in injection molding, which resin composition contains a molding grade phenolic resin and an effective amount of a reactive compound (e.g., para-t-butylphenol) that is capable of reducing the viscosity of molding compositions containing said phenolic resin compositon to a processable viscosity at a temperature at which the period of time within which said molding composition cures to a thermoset state is longer than the period of time that said molding composition is in the runner during a normal injection molding operation. There is also disclosed molding compositions containing said phenolic resin composition, and an injection molding process utilizing the same.
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