| 摘要 |
PURPOSE:To get a wafer lapped with little warp and even thickness despite the large or small warp of the original slice, by lapping its one side after simultaneous lapping on both sides and then giving the final touch of simultaneous lapping on both sides again. CONSTITUTION:After the initial simultaneous lapping on both sides, the convex surface of a wafer 1 is bonded to a bonding board 2 to undergo lapping on the concave surface as shown by a broken line. Finally the wafer 1 is removed from the board 2 for another simultaneous lapping on both sides to get the product with little warp and even thickness. |
