发明名称 LEAD FRAME FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To increase the yield when fine wires are connected by processing metal sheets or bringing some inner point positions of a lead frame comprising both a group of lead wires and an element mount part backward and expanding the inner points of the other leads. CONSTITUTION:An element mount part 3, outer leads 4a, 4', 4c, 4d..., and an inner frame 5 for fixing the outer leads are equipped by photographically etching Koval sheets, etc. between outer frames 1a, 1b. The position of an inner point of an inner point of a certain lead such as a lead 4' which is'nt connected with a metal fine wire is formed at a more rear position than those of other leads 4a, 4c,.... The clearance produced by the above is supplement by an expanded inner point width l of other lead 4a, etc.
申请公布号 JPS5534453(A) 申请公布日期 1980.03.11
申请号 JP19780107043 申请日期 1978.08.31
申请人 NIPPON ELECTRIC CO 发明人 MIYAIRI KATSUYOSHI
分类号 H01L23/50;H01L23/495;H03H9/13 主分类号 H01L23/50
代理机构 代理人
主权项
地址
您可能感兴趣的专利