| 摘要 |
PURPOSE:To utilize the whole area of tip effectively as well as to facilitate the correct masking process with ease by arranging masking patterns within the pattern of bonding pad. CONSTITUTION:A part of bonding pads 19 being arranged on the margins of IC region 18 is designated as bonding pad 19a having pattern 20 for masking. Those patterns which have no room to be accommodated within the bonding pads 19a are formed on their adjacent area as patterns 20a. By masking correctly utilizing those patterns 20 and 20a, IC region 18a could be arranged on the area as conventionally used for masking. |
