| 摘要 |
<p>PURPOSE:To heighten heat radiation effect of semiconductor device for electric power by employing specific resin containing beryllia porcelain material as filler. CONSTITUTION:Resin 10 for sealing purpose of semiconductor element consists of epoxy resin or silicon resin, into which hardening agent and mold releasing agent containing 30-70wt% beryllia porcelain material as filler is mixed. Because it unnecessitates the use of copper-base material, thinning of package is feasible, and also facilitate the shortening the distance between the radiation plate 8 made of Al and the like and the pellet 1 which heightens the radiation effectiveness. Thus, the above invention helps greatly the increment of heat radiation effectiveness in the semiconductor device for electric power.</p> |
