发明名称 |
Multi-layer dielectric structure |
摘要 |
The coating of a conductor pattern on dielectric green sheets to a common edge thereof with stacking or superimpositioning together of a plurality of sheets to enclose the conductor pattern followed by sintering, with the edge side of the fired body having the exposed end terminations becoming the actual face of the body on which a semiconductor device is mounted in electrical circuit connection to respective ones of the common end terminations of the conductor runs. The opposite or distal ends of the conductor runs may be fanned out to the opposite edge of side of the fired body in increased spaced relationship to each other.
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申请公布号 |
US4193082(A) |
申请公布日期 |
1980.03.11 |
申请号 |
US19780918214 |
申请日期 |
1978.06.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORP |
发明人 |
DOUGHERTY, WILLIAM E |
分类号 |
H01L23/498;H01L23/538;H05K1/00;(IPC1-7):H01L39/02 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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