| 摘要 |
PURPOSE:To completely solder a hybrid integrated circuit without bubble by fixing the position of the circuit by a jig and slodering in a solder dip and to provide superior mass production of the circuits. CONSTITUTION:A metal heat sink 8 associated with a heating semiconductor element 7 is disposed by a position fixing jig 9 of metal not soldered on a part attaching land 6 provided on an insulating substrate 5. When flux is then coated on the heat sink 8, it is penetrated between the land 6 and the heat sink 8 by means of capillary phenomenon. When the flux is then dipped in molten solder, solder fills in the air gap between the land 6 and the heat sink 8 by means of capillary phenomenon to thereby solder between the heat sink 8 and the substrate 5 preferably electrically and thermally in best state. |
