Solder connection formed by gap in disc - placed between conducting paths on printed circuit board so that solder beads join profiled ends of path

摘要

The solder connection has the ends of the two conducting paths extended laterally so that together they form a disc. The latter has a gap (5) passing across it to separate the two ends of the paths. This insulating gap is bridged by the solder bead which spreads over the entire disc. The gap may be V-shaped, dovetail or zigzag. Any suitable number of conducting paths may be joined together using one bead of solder. The advantage lies in cheapness.