WATER COOLING HEATSINK FOR SEMICONDUCTOR ELEMENT,申请号JP19780103995-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	WATER COOLING HEATSINK FOR SEMICONDUCTOR ELEMENT
摘要
申请公布号	JPS5530852(A)	申请公布日期	1980.03.04
申请号	JP19780103995	申请日期	1978.08.25
申请人	NIPPON ELECTRIC CO	发明人	SUZUKI AKIRA
分类号	F25D1/02;H01L23/46;H01L23/473	主分类号	F25D1/02
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Fishtail expendable diamond drag bit

Developing device drive mechanism for selecting and powering developing units

Earthquake resistant building support system

Door shield construction

Power steering system

Picture hanging device

Blade holder for reciprocating saws

Method of making a magnetic recording head

Sectioned cutting blade

Method of manufacturing an electrohydraulic probe

Burner construction and method of and apparatus for making the same

Optical isolator

Low voltage BiCMOS and high voltage BiCMOS the same substrate

Environmentally sealed switch construction

Method of shaping and felting open cell polychloroprene latex foam

METHOD OF PLANARIZING A DIELECTRIC FORMED OVER A SEMICONDUCTOR SUBSTRATE

CELL ASSAY DEVICE USED IN A MICROPHYSIOMETER

PHOTOGRAPHIC ELEMENT HAVING BOTH A FILTER DYE LAYER AND A MATTE LAYER