| 摘要 |
PURPOSE:To facilitate the adhesion to an article to be detected, to increase the durability and to improve the heat-sensitiveness by using a dual type heat-sensitive magnetic element, which is prepared by adhering metal having a thermal conductivity of 170-360Kcal/mh deg.C to the surface of a normal heat-sensitive magnetic element. CONSTITUTION:A heat-sensitive magnetic element 2 is soldered with high adhesive strength or diffusion-soldered at 3 to a metal substrate 1, which has a thermal conductivity of 175-360Kcal/mh deg.C, and then is machined. The dual type heat-sensitive magnetic element 23 thus prepared is soldered at 24 at a high temperature to the hole or groove which is formed in advance in the outer wall of the level detecting position of the molten steel 22 in a mold 21. Thus, even if a thin element is used as the heat-sensitive element, the overall rigidity can be enhanced so that a sufficient adhesion strength can be obtained without any deformation during the soldering operation. Thanks to the reduced thickness of the element 1, it is possible to improve the responsiveness of the element accompanying the variation in the molten steel level in the mold. |
