发明名称 EPOXY BOND DIAMOND SAW
摘要 <p>A cutting tool is disclosed comprising a plurality of blocks of composite, comminuted abrasive in a metal matrix, resiliently mounted to a metallic substrate by an elastically pliant epoxy based adhesive. In a preferred embodiment of the invention a relatively thin layer or film comprising a flexible metal such as copper, metallurgically bonded to the metal matrix, is sandwiched between the blocks and the epoxy adhesive, and contributes to the resiliency of the mounting, and promotes bonding to the epoxy.</p>
申请公布号 CA1072862(A) 申请公布日期 1980.03.04
申请号 CA19770275797 申请日期 1977.04.07
申请人 HALL, GEORGE H. 发明人 HALL, GEORGE H.
分类号 B28D1/08;B28D1/12;(IPC1-7):28D1/12;28D1/08 主分类号 B28D1/08
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