| 摘要 |
PURPOSE:To prevent poor results from occurring by making material to be coated into atomized one, spraying it on a semiconductor to build an insulating film, and putting the semiconductor in an air-tight state. CONSTITUTION:As the under-coating material is, in almost all cases, coated in such a way that it encloses a pellet, such a method often transforms the wire connection and cause inferior characteristics because this type of coating is difficult. Therefore, if the PIQ resin is atomized and sprayed on the semiconductor, coating becomes easier, preventing the wire connection from being transformed, and inferiority in quality can be reduced when it is kept air-tight. Besides the spraying method, an insulating film may be built up according to the CVD method. |
