| 摘要 |
<p>PURPOSE:To automatize work operation, by bending the workpiece along the surface of a circular column and thereby dividing wafers simultaneously. CONSTITUTION:Wafer 6 pasted to carrier sheet 7 is mounted on table 5. Pushing plate 3 is pressed on wafer 6, by means of pressure shaft 2, by pressure device 1. By this, wafer 5 is bent along the curved lower surface of pushing plate 3 and is divided in one direction along a pre-arranged scribe line. Next, pressure device 1 is lifted. It is rotated 90 deg. by means of turning device 4, and then dividing is done in the direction perpendicular to the previous direction.</p> |
