| 摘要 |
PURPOSE:To use the same substrate in common, to reduce the manufacturing cost of an optical pickup and to facilitate the control of its parts by making the number of lands in a part where a diode chip is fitted larger than the number of the terminal pads of the diode chip. CONSTITUTION:The number of lands 4 of a pattern 6 in the part where a diode chip 1 is fitted is made larger than the number of terminal pads 5 of the diode chip by one. As a result, either in the case of a + power source circuit (illustrated by (a)) or in the case of a - poser source circuit (illustrated by (b)), the diode chip can be fitted on the same substrate. Therefore, the diode chip can be fitted oppositely in accordance with +, - of the power source and the substrate can be used in common. Thus, the manufacturing cost of the optical pickup can be reduced and its parts can be easily controlled. |
