| 摘要 |
A cover unit for hermetically sealing a container for a semiconductor device comprises a rectangular metallic cover element such as a cobalt-nickel-iron alloy and a plurality of contiguous turns of wire of a heat-fusible material such as a gold-tin eutectic alloy formed and disposed on the cover element with the outermost turn substantially in registry with the periphery thereof, said turns being spot-welded thereto substantially at the corners of the cover element. The preferred method of fabricating the foregoing hermetic sealing cover unit comprises disposing it in a shallow cavity of a rotatable nonconductive supporting member, such cavity having dimensions to retain the cover element in desired position and forming a flat single-layer multiturn wire winding of heat-fusible material by winding it on a mandrel in contact with the cover element and rotatable therewith and spot-welding the winding to the cover element at a plurality of spaced points. An apparatus for performing the foregoing method comprises a rotatable nonconductive supporting member having a shallow cavity for receiving and closely fitting a cover element, a mandrel rotatable with and engaging the supporting element and having an annular recess proportioned to receive a single-layer multiturn wire winding and having an extending supporting shaft, means for rotating the supporting member and the mandrel together with means for feeding wire to the mandrel to form such single-layer multiturn winding. The apparatus also includes a nonrotatable electrode assembly disposed about the shaft and normally disengaging the cover element but movable axially of its shaft to spot-weld the multiturn winding to the cover element.
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