发明名称 SOLDER FOR HARDDTOOSOLDER MATERIAL
摘要 PURPOSE:To provide a solder essentially composed of Pb, Sn, Zn and/or rare earth metal and In and/or Bi with a specifieb blending which enables the bonding of hard-to-solder material such as glass at a low temperature. CONSTITUTION:This solder is composed of 1-97.5% Pb by weight, preferably 80-95%, 1-97.5% Mn, preferably 5-30%, 0.05-15% Zn, and/or 0.01-15% rare earth metal, 0.1-50% In and/or 0.01-60% Bi as essential components. This rare earth metal preferably employs so-called cesium mesh metal composed of 86.8% Ce, 3;0% La, 4.0% Nd, and 6.2% Sm and Pr and impurities from an economical point of view. Slight addition of more than one kinds of Al, Si, Ti and Be can prevent tarnish on the surface of the solder. This solder is applicable to metal, crystalized glass alumina and the like besides glass.
申请公布号 JPS5524720(A) 申请公布日期 1980.02.22
申请号 JP19780096649 申请日期 1978.08.10
申请人 ASAHI GLASS CO LTD 发明人 TAKEHARA MIKIO;NOMAKI KOUJI
分类号 C22C11/00;B23K35/26;C22C12/00;C22C13/00;C22C30/00 主分类号 C22C11/00
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