摘要 |
A leaded mounting and connector unit for an electronic device wherein the unit includes a structure having two parallel sides and a plurality of metallized areas which connect with spaced metallized areas provided at the parallel sides to which terminal leads are bonded. Grooves provided in the two sides receive the terminal leads which, in some cases, can extend beyond the sides serving to locate a cover or locate and connect with a leadless structure positioned above the leaded unit. The terminal leads are provided with tab members for locating the leads relative to the structure and to locate a leadless structure at a position above the leaded unit. |