首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
SEMICONDUCTOR DEVICE
摘要
PURPOSE:To secure a rigid bonding by making coarse the surface of the foundation metal at the connective area of the external lead-out wire and then applying the Ni plating.
申请公布号
JPS5434678(A)
申请公布日期
1979.03.14
申请号
JP19770100759
申请日期
1977.08.22
申请人
MATSUSHITA ELECTRONICS CORP
发明人
FUJII HIROYUKI;TATENO KENICHI;SHIMA MICHINORI
分类号
H01L21/60;H01L23/48
主分类号
H01L21/60
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Compressor or like variable-camber aerofoil vanes
Explosive compositions
Improvements in or relating to power assisted steering
Retractable safety belt apparatus
Improvements in or relating to apparatus for anchoring prestressing members in prestressed concrete
Detergents
Thumb release casting attachment for fishing rods
A process of the production of new 3-tolylthio-1-piperidinopropanols-2
Piperazinones and processes for their preparation
High speed hammer
Improvements in or relating to antimonic acid products having cation exchange capacity
Programme-selecting devices for automatic washing machines
Method for the stabilization of chlorinated hydrocarbons
Improvements in calcia-magnesia-alumina seal compositions
Improvements in remote guidance systems utilizing infra-red radiations
Apparatus for measuring the current at the individual electrodes of electrolytic cells
Light intensity redistribution
Grinding machines
Suspension drier for materials in web form
Improvements in or relating to conveyor systems