Low temperature and low cost assembly process for nonlinear resistors

摘要

A low cost two step process for attaching conductive leads and heat dissipating elements and for encapsulating a ceramic non-linear resistor pellet is described. Low temperature soldering techniques are utilized to assemble the device. Low temperature soldering is made feasible by the treatment of the attaching surfaces of the pellet with a dilute solution of acid for reducing the oxide surface to a pure metal in preparation for soldering.