发明名称 PHOTO SEMICONDUCTOR ELEMENT PACKAGE
摘要 PURPOSE:To perform coupling of a cap and a stem in a short time with a simple structure and enable the internal airtightness to be surely maintained by providing an annular groove filled with coupling material to the flange part for bonding of stem circumferential edge. CONSTITUTION:A photo semiconductor element 6 such as LED is secured onto the metallized layer 1 formed on the surface of the support plate 10 on a metal-made stem 2 and the respective electrodes thereof are connected by means of the layer 11 and lead wires 12 to the lead terminals 5, 5 secured by glass 13 onto the stem 2. A metal sleeve 8 for protection inserted and fixed with an optical fiber 9 is fixed by means of resin 7 in the central part of a cap 1. The lower part of the cap 1 is fitted into the annular groove 15 having an upward circumferential wall 14 of the flange part 3 for bonding of the stem 2 and ring solder 4 is hot melted in the circumference thereof. In this state, the cap 1 and stem 2 are aligned and butted together in such a manner that the fiber 9 and element 6 assume the maximum coupling efficiency, after which the solder 4 is allowed to cool by itself.
申请公布号 JPS5522709(A) 申请公布日期 1980.02.18
申请号 JP19780094513 申请日期 1978.08.04
申请人 FUJITSU LTD 发明人 NAKAYAMA TAKAYUKI;INAGAKI NOBUHIRO;NAMAZU RIYOUSUKE
分类号 G02B6/42;H01L31/0232 主分类号 G02B6/42
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