| 摘要 |
1499578 Cooling circuit boards SUNDSTRAND HEAT TRANSFER Inc 30 Oct 1975 [25 Nov 1974] 44838/75 Heading F4U [Also in Division H1] An assembly comprises a circuit board 10 for a digital computer and an associated heat transfer structure through which an array of terminal pins 62, 64 of the circuit board extends, the array defining rows of mountings for integrated circuit modules 28, wherein the heat transfer structure comprises a first heat transfer surface 42 abutting the board 10, a second heat transfer surface 38 for abutting, in use, the modules 28, and between the two said surfaces 38, 42, a heat pipe associated with each row of mountings: and extending along the length of the row into a cooled condenser region (30, Fig. 1). The heat transfer structure also includes a central layer 40 which, with the aid of spacer elements, defines the heat pipes. The heat pipes include longitudinal capillary grooves 44. The layers 38, 40, 42 are formed of aluminium. An insulating layer 66 surrounds each terminal pin 62, 64. |
