发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To suspend a wire bonding device by putting a detection circuit on a closed condition by contact of a detection element and wire element, with the detection circuit contacting with this wire in perfoming a cutting of the wire. CONSTITUTION:When a capillary 5 is shifted from a first bonding position 14 to a second bonding position 16, a clamper 10 is opened, and a tension is given to a wire 2 by the air supplied from a tension giving device 9. Thereafter, the wire 2 has a trouble of cutting. In this case, the wire 2 is loosened the dtection circuit is closed by a contact of the wire 2 with a detection element 4 to suspend an operation of the wire bonding device.
申请公布号 JPS5521134(A) 申请公布日期 1980.02.15
申请号 JP19780093756 申请日期 1978.08.01
申请人 发明人
分类号 H01L21/66;H01L21/60 主分类号 H01L21/66
代理机构 代理人
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