| 摘要 |
PURPOSE:To very economically plate a part of one side of a metal sheet, by using a non-electroconductive nozzle plate and a soluble anode. CONSTITUTION:The metal sheet 9, which is used as a cathode, is set on a mask plate 8 so that the plated part of the sheet accurately coincides with the hole 5 of the mask plate 8. The sheet 9 is tightly fitted on the mask plate 8 by a rubber board 10. The nozzle plate 18, which is made of non-electroconductive synthetic resin and has a plating liquid ejection hole 17 of prescribed form, is fitted in the upper part of an inner box 16. The soluble anode 19, which is a plating material such as gold or silver, is provided in the inner box 16. A plating liquid feed pipe 21 is inserted into the inner box 16. A plating liquid is ejected out of small holes of the pipe 21 to electrochemically dissolve the anode 19. The plating liquid flows in the direction of the arrows in Fig. to plate the metal sheet 9 with the material. Since the anode is dissolved, no metal salt needs to be supplemented and anodic oxidation does not take place. The nozzle plate of synthetic resin is more economic than those of platinum. The present method and device are appropriate to plate the bonded part of a semiconductor device with gold, silver or the like. |
