| 摘要 |
A s.c. device comprises a s.c. substrate 51 an electrode pattern 52 thereon, and a protective coating 56 of a resin either on a surface, an edge portion or a corner of the substrate so that during subsequent mounting steps such as scribing the wafer or connecting the electrode pattern to a conductor pattern 32 of a printed circuit board 31 through openings in the coating 56, the substrate is not damaged. Typically the thickness of the protective coating is more than 2 ???m. A PSG coating 53 may be provided underneath the coating 56. <IMAGE> |
