| 摘要 |
PURPOSE:To deposit Ni or Ni alloy layer and Au-Ge-Sb alloy layer on a contact surface of a semiconductor device and adhere it firmly to a floor. CONSTITUTION:After Ni layer and Au-Ge-Sb metal alloy layer are evaporated onto contact surface of Si basic plate, it is divided into chips and soldered to a silver plated floor. This constitution allows precise positioning for soldering by using Au- Ge-Sb layer without using gold foil and chip division is easy for non-using of Si-Au cristal and further adhesion is very strong. |
