| 摘要 |
PURPOSE:To enable attachment of a chip to be achieved within a required time by controlling a heat source in such a manner as to provide a collet with a chip surface temperature measuring element. CONSTITUTION:A chip 3 is fixed onto top end of a collet by reducing pressure of a cavity 6, and it, while being kept as it is, is shifted to a package attaching surface 2. By pressing the chip against the surface 2 by a constant pressure, hot air of N2 is sent and heated up to a temperature appropriate for attachment. In this case, the chip's surface temperature is continuously measured by a temperature measuring element 5 set in the cavity 6 facing the chip 3, and a heat source power control signal is emitted so that attaching operation can be accomplished in a required time and within an attachment temperature range. It is possible, in this way, to attach a chip without causing any thermal damage to the chip. |
