| 发明名称 |
Homogeneous low melting point copper based alloys |
| 摘要 |
A copper based low melting point metal alloy composition consists essentially of about 2.5 to 11 atom percent tin, about 0 to 12 atom percent nickel and about 11 to 15 atom percent boron, the balance being essentially copper and incidental impurities. The composition is such that the total of copper and tin ranges from about 85 to 89 atom percent.
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| 申请公布号 |
US4448852(A) |
申请公布日期 |
1984.05.15 |
| 申请号 |
US19830488858 |
申请日期 |
1983.04.26 |
| 申请人 |
ALLIED CORPORATION |
发明人 |
BOSE, DEBASIS;DATTA, AMITAVA;DECRISTOFARO, NICHOLAS J. |
| 分类号 |
B23K35/02;B23K35/30;B23K35/40;C22C9/02;C22C45/00;(IPC1-7):C22C9/00 |
主分类号 |
B23K35/02 |
| 代理机构 |
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