| 摘要 |
MODULAR HOUSING FOR ELECTRONIC APPARATUS A modular housing molded of a thermoplastic material and arranged for containing electronic circuitry is disclosed. The modular housing includes a box-like base unit, two removable modules, and a rear cover unit. The base unit forms a first housing for containing electrical apparatus. The upper surface of the base unit includes two traylike recesses for receiving and containing the two modules which are configured for containing additional electronic apparatus. The base unit recesses and the modules are configured and arranged such that each module is securely retained within the base unit recesses without the use of conventional tray-like recess in which the rear cover unit is mounted to form a compartment for containing additional electronic apparatus. Like the mounting arrangement for the two removable modules, the rear cover and the housing unit recess for the mounting thereof are arranged such that the cover unit is securely affixed to the base unit without the use of conventional fasteners. A removable dust cover is mountable to the base unit for protecting the assembled unit when not in use. When mounted to the base unit, the dust cover is swingable in a upward direction such that the assembled unit can be utilized without removing the dust cover from the base unit. In a arrangement of the invention wherein one of the removable modules includes a keyboard for manually supplying information to the electrical circuit contained within the module, a bezel is provided for preventing the simultaneous depression of more than a signal key. |
