| 摘要 |
For manufacturing multilayer circuits, the inner layers of which consist of the flexible base material described in FR-PS 2,094,162, and is used as a prepreg of the thermoplastic of this base material, the printed circuit boards are tempered at a temperature close to the melting point of the thermoplastic, a plurality of printed circuit boards are then sandwiched together using the same, untempered thermoplastics and are pressed together at a temperature near the melting point of the untempered thermoplastic. In the production of a direct composite - multilayer circuit/flexible printed circuit board - one or more sections of the flexible printed circuit used for the production of the multilayer circuit are pressed together either as a prepreg or directly as an inner layer. <IMAGE> |
