| 摘要 |
PURPOSE:To perform highly reliable pellet soldering with less void by employing processes of solder feeding preparatory soldering soldering rapid cooling ( wire bonding). CONSTITUTION:Disc solder 12 is fed to a header 10, and the solder 12 is temporarily attached to the header 10. Next, after it is sent into a solder furnace for preparatory soldering, semiconductor pellet 18 is located against the header 10 for melting the solder 12 to be fixed while given vibration and loading. Next, the header 10 which has completed the location of the pellet 18 is led to a cooling block, where it is rapidly cooled by the blowing of coolant gas.
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