| 摘要 |
PURPOSE:To establish a transfer mold very economically by filling a pot with the mold resin equal to the amount for filling a mold portion with the desired material and at least the liquid material or gas sufficient to fill the runner portion therewith. CONSTITUTION:A resin tablet 10' supplied to a pot 2 is slightly much than the material for sealing a semiconductor element. Because a tablet 20 supplied successively may not reach to the element mold directly, the resin having a low purity similar to the resin 10, the resin having a high heat hardening temperature, or a tablet molten and transfered by the liquid or gas is led to a metalic mold 3 through the runner portion 4. According to such a method, then the resin having a high purity used directly for the element mold, the cheaper resin 20 can be utilized at a very low cost (60 to 80 percent for the total) to establish the transfer mold very economically. The cheaper resin left in the pot and runner portion is dumped after picking up. |
