| 摘要 |
PURPOSE:To form the outside surface consisting of a pack case and a body housing integrally, and to make it thin by eliminating a projecting part, by forming the outside surface of a case of a semiconductor storage pack, to match the housing shape of an information processor body. CONSTITUTION:Detaining pieces 11c, 11'c and projections 11b, 11'b of a pack are inserted into the apertures of recessed parts 23a, 23b and guide grooves 21a, 22a of a body by moving backward a slide plate from a window 12a and inclining forward a semiconductor pack. In this state, the rear part of the pack is pressed elastically in the lower direction and pushed in forward, the projections 11b, 11'b are engaged to grooves 21b, 22b, and also, a reed piece 14 advances in a state that is presses elastically a connector pin 25, and an electric connection is formed exactly. When the pack is pushed in until a prescribed position in this way, the pack fills up the containing part and installed by forming a part of the body housing, and in this stage, it is prevented to falling off by inserting a pin 4 into the pack by operating a knob 3.
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