发明名称 WIRE BONDING MACHINE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To perform wire bonding by a tool attached to the top end of an arm by driving the arm up and down in a threaded contact with a vertical shaft by its rotation. CONSTITUTION:A screw 21a is provided in the other circumference of a vertical shaft 21 and the shaft 21 makes rotation by a motor 22 to drive up and down a transmission arm 23. A bonding arm having a bonding tool 25 attached to its one end is supported at a fulcrum of the arm 23 and is adjusted by a spring 26b and screw 23b. The motor 22 is controlled by a signal from P-ROM31 through CPU32 and drive circuit 33. According to this construction, the tool 25 can be set at an accurate position because it may make a linear movement and the rapid recovery can also be made possible because jumping of the tool is prevented with the soft approach.
申请公布号 JPS5513908(A) 申请公布日期 1980.01.31
申请号 JP19780086143 申请日期 1978.07.17
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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