| 摘要 |
PURPOSE:To obtain the desired thickness of solder and perform positioning of an insulating board with high accuracy as well by forming a hole at a part where a heat sink is in contact with solder, thereby covering the hole with the insulating substrate. CONSTITUTION:Solder 2 is used to bond a heat sink 1 to an insulating board 3 and solder 6 is used to bond it to a semiconductor element 7. Further, this device makes a hole prepared in an insulating substrate 1 smaller than the insulating board 3 and the thickness of solder is obtained by subtracting the thickness of a rear face pattern 4 of the insulating board 3 from the depth of a recessed part. Then, solder 2 located between the heat sink 1 and the insulating board 3 exists only in the recessed part and the existence of solder in this way allows this device to make use of self-alignment capacity fully by virtue of the surface tension effect of solder. Thus, accurate positioning is performed and the thickness of solder is controlled by changing the depth of the recessed part and then, the desired thickness of solder is obtained. |
